“Today's call represents another milestone for Qualcomm in the evolution of the HSPA road map,” said Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies. “End users will enjoy quicker connections to the Internet with HSPA+ while network operators will appreciate the opportunity to offer more services to their subscribers.”
HSPA+, also known as HSPA Evolved, is designed to enhance the mobile broadband user experience and enable a wide range of services. The technology delivers higher peak and average data rates, lower latency, better response times, longer battery life and an enhanced, always-on experience compared to the current generation of mobile networks.
The latest evolution of WCDMA technology, HSPA+ Release 7, will offer downlink data transfer rates of up to 28 Mbps and uplink rates of up to 11 Mbps. Future HSPA+ releases are expected to support downlink peak rates of 42-84 Mbps and uplink peak rates of 23 Mbps by using a variety of advanced techniques, including multiple carriers for transferring data. HSPA+ is backward compatible with prior generations of WCDMA and does not require new spectrum for deployment. Operators can leverage their existing network and spectrum resources to offer next-generation wireless bandwidth and performance.
Qualcomm's MDM8200 chipset is currently sampling to customers and supports deployments in existing frequency bands, as well as in the 900 MHz band and the 2.5 GHz IMT-2000 extension band.
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2008 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including operators' desire to utilize HSPA+ technology, the Company's ability to successfully design and have manufactured significant quantities of MDM8200 chipsets and other components on a timely and profitable basis, the extent and speed to which HSPA+ is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2007, and most recent Form 10-Q.
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